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Ion Beam Equipment Product List

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[DL Available] Cross-section preparation of micro objects (IC contact part) using FIB.

[DL Available] Cross-section preparation of micro objects (IC contact part) using FIB.

With FIB, it is possible to create cross-sections at arbitrary locations of small objects (for example, the IC contact area), targeting specific spots.

Our company's FIB (Focused Ion Beam) equipment can create cross-sections of objects approximately 0.1μm in size with precision. Using this technology, we can produce thin samples for TEM observation at exact locations. In this case, we introduce "Cross-section creation and observation of IC contact parts using FIB equipment." Please take a moment to read the PDF materials. Additionally, our company specializes in wiring modifications for ICs and LSIs using FIB. Specifically, we offer the following services: - Cutting of wiring - Connecting of wiring - Fabrication of test pads for characteristic evaluation We perform these tasks in a short turnaround time to assist our customers in their IC and LSI development. Furthermore, as a related technology to FIB, we have a case study on "Method for discovering abnormal areas within plating layers using FIB." We would be happy to discuss how you can utilize FIB equipment. *Please feel free to contact us if you need more details. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/

  • Contract Analysis
  • Processing Contract
  • Other Connectors

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Observation of cross-sections of microscopic foreign objects

Observation of cross-sections of microscopic foreign objects

We excel at obtaining clear SEM images and elemental analysis of minute foreign particles through advanced sample processing!

FIB (Focused Ion Beam) processes the sample surface by irradiating and scanning a finely focused Ga ion beam on the sample surface. FIB enables precise microfabrication of targeted areas, allowing for cross-sectioning even in very small regions of a few microns.

  • Contract Analysis
  • Contract measurement
  • Contract Inspection

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【Equipment】FIB (Focused Ion Beam)

【Equipment】FIB (Focused Ion Beam)

Semiconductors, MEMS, liquid crystal glass, etc.! Capable of cross-section processing in micro areas and producing TEM samples.

We would like to introduce the equipment owned by Aites Co., Ltd., the Focused Ion Beam (FIB). The "FIB (Focused Ion Beam)" is a device that narrows Ga ions to less than a few micrometers and scans the beam to eject atoms from the sample surface while processing micro-regions. It is capable of cross-sectional processing of micro-regions and the production of TEM samples for semiconductors, MEMS, liquid crystal glass, build-up substrates, and more. 【Available Equipment】 ■ Crossbeam FIB "Carl Zeiss 1540XB" ■ Single Beam FIB "SEIKO SMI 2200" *For more details, please refer to the PDF document or feel free to contact us.

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  • Other contract services
  • Processing Contract

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Data DL available: Pattern drawing on Si substrate using FIB device.

Data DL available: Pattern drawing on Si substrate using FIB device.

The FIB device can perform high-precision patterning on silicon substrates. It is maskless, making it ideal for prototyping.

The FIB (Focused Ion Beam) device allows for maskless pattern drawing (pattern formation) of arbitrary shapes. - In pattern drawing through etching, it is possible to draw with a size of about 0.1μm per dot. (The minimum size varies depending on the material being processed and the processing conditions.) - Maskless ion implantation is also possible. - Pattern drawing through deposition is also feasible. In this case, we introduce how to actually draw patterns on a silicon substrate using the FIB device. Additionally, our company specializes in wiring modifications aimed at circuit corrections for ICs and LSIs using FIB. Specifically, we offer the following services: - Cutting of wiring - Connecting wiring - Fabrication of test pads for characteristic evaluation We carry out these tasks appropriately and in a short turnaround time to assist our customers in their IC and LSI development. We would be happy to assist you, so please feel free to consult with us. *If you need more details, please feel free to contact us. Seiko Future Creation Official Website https://www.seiko-sfc.co.jp/

  • Contract Analysis
  • Printed Circuit Board
  • Processing Contract

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<Downloadable Material> [FIB-SEM] Method for Detecting Anomalies in Plating Layers

<Downloadable Material> [FIB-SEM] Method for Detecting Anomalies in Plating Layers

The FIB-SEM device allows for the observation of abnormal areas within the plating layer that are difficult to discern from the surface, and the Slice & View function enables the discovery of the origin of the abnormalities.

The FIB (Focused Ion Beam) device can automatically create continuous cross-sections and obtain cross-sectional images. Using this function, it is possible to identify abnormal areas within a sample that are difficult to discern from the surface. In this case, we will introduce the method of discovering abnormal areas within a plating layer that cannot be detected from the surface using the continuous automatic cross-section production function of the FIB device. For more details, please refer to the PDF document or feel free to contact us. *Additionally, our company specializes in wiring modifications for ICs and LSIs using FIB for circuit corrections. Specifically, we offer the following services on a short turnaround: - Cutting of wiring - Connecting wiring - Fabrication of test pads for characteristic evaluation We are here to assist with your IC and LSI development, so please do not hesitate to consult with us. *We also have other materials available. If you request them through the inquiry button, we will send them to you.

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  • Plating Equipment
  • Other metal materials

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